Advanced ceramic metallisation
Precision Surface Engineering

Metallisation

Precision metal coatings on ceramic substrates for electronics, sensors, and advanced engineering applications

Advanced Ceramic Metallisation

Henson Ceramics Limited has an in-house metallisation facility for the bonding of molybdenum and moly/manganese to alumina ceramic under high temperature, controlled atmosphere conditions which subsequently allows the ceramic to undergo conventional brazing to form a vacuum-tight ceramic to metal bond.

Such components are used in high power applications, for example, and others which require good electrical insulation, high thermal shock resistance, high mechanical strength, and good vacuum integrity.

HCL manufactures all of its inks and coatings in-house, making it possible to cater for almost any specialist coating application. Facilities are also available for the bonding of silver, platinum, gold, chrome, nickel, and a variety of cermets to the entire range of ceramics.

Metallised ceramic components

Technical Capabilities

Metal Options

Wide range of metallisation materials:

  • Molybdenum and Moly/Manganese
  • Gold, Silver, Platinum
  • Chrome and Nickel
  • Cermets and composite coatings

Deposition Techniques

Advanced deposition methods:

  • Banding
  • Electroplating
  • Evaporation
  • Screen printing
  • Valve dispensing

Performance

High-quality specifications:

  • Vacuum-tight ceramic to metal bonds
  • High thermal shock resistance
  • Operating temp: up to 1000°C

Advanced Coating Technology

A multiple layer and multiple phase approach is adopted for the majority of coating applications. An in-depth knowledge of the effect of particle size distribution and reactivity of the various fillers/fluxes which are employed allows the ultimate deposit to be achieved.

Applications

Electronic Substrates

Circuit patterns and interconnects for hybrid electronics

Sensors

Electrodes for temperature, pressure, and gas sensors

Heating Elements

Resistive heating tracks for industrial and medical devices

Capacitors

Electrode layers for multilayer ceramic capacitors

RF Components

Conductive patterns for microwave and telecommunications

Medical Devices

Biocompatible electrodes and implantable components

Automotive Sensors

Lambda sensors and exhaust gas monitoring systems

Power Electronics

Substrates for high-power semiconductor modules

Vacuum Switches

High vacuum envelopes and electrical insulation

Image Intensifiers

High-performance imaging and detection systems

Why Choose Our Metallisation Services

Precision Patterning

Accurate metal deposition with tight tolerances for complex designs

Strong Adhesion

Excellent metal-to-ceramic bonding for long-term reliability

High Conductivity

Low resistance pathways for efficient electrical performance

Thermal Stability

Metallisation layers stable at elevated operating temperatures

Custom Formulations

Tailored metal pastes and processes for specific requirements

Quality Assurance

Rigorous testing and inspection to ensure consistent quality

Ready to Discuss Your Metallisation Needs?

Contact our technical team to explore how our metallisation services can enhance your ceramic components